Overview of air flow classification of micropowder
Grinding product characteristics: green silicon carbide powder is green, crystal structure,High hardness, strong grinding ability and stable chemical properties.Thermal conductivity Good energy, micro shape, hexagonal crystal, Mohr's hardness of silicon carbide The hardness of abrasives is higher than that of corundum and second only to diamond, Cubic boron nitride and boron carbide.
Grinding product features: high purity, high hardness, narrow distribution,Good grain shape, no big grain, super fine, clean single grain and so on
Main technical specifications:
Industry standard | Specification and granularity | colour | Purity (%) | iron % | carbon % |
Japanese standard JISR6001-1998 | JIS320#. JIS360#. JIS400#. JIS500#. JIS600#. JIS700#. JIS800#. JIS1000#. JIS1200#. JIS1500#. JIS2000# |
Pure green |
≥99 |
≤0.02 |
≤0.01 |
Original national standard GB2481-83 | W63#. W50#. W40#. W28#. W20#. W14#. W10#. |
Pure green |
≥99 |
≤0.02 |
≤0.01 |
national standard GB/T2481.2-1998 | F280#. F320#. F360#. F400#. F500#. F600#. F800#. |
Pure green |
≥99 |
≤0.02 |
≤0.01 |
Other specifications can be customized according to user requirements
Main product uses:
Application fields of SiC grinding products: polishing of machine parts, polishing of metal products, polishing of cylinder, piston ring, pump body, nozzle, bearing, roller and ball, polishing of precision gauge, polishing of glass lens, prism, flat crystal and other products.SiC powder is also widely used in refractories, wear-resistant floor, foam ceramics, special coatings, corrosion resistant paint, desulfurization, environmental protection and other industries.
Silicon carbide wire cutting blade products application: 3-12 inch monocrystalline silicon, polycrystalline silicon, potassium arsenide, quartz crystal wire cutting, solar photovoltaic industry, semiconductor industry, piezoelectric crystal industry engineering processing materials.It can produce special products according to the user's requirements to meet the individual requirements of different wire cutting equipment, different wire cutting materials, different wire cutting material diameter and different wire cutting wire diameter.
