Once upon a time, the green silicon carbide blade was accompanied by the domestic photovoltaic industry, and its close relationship with the cutting of photovoltaic wafers made her a market scent. Since 2011, with the disillusionment of the domestic photovoltaic leap forward mystery, coupled with the emergence of alternative diamond cutting lines, this infinite powder material has almost disappeared. Today, the presence of this material is faintly visible, and the cutting of silicon wafer semiconductors has become the last position of green silicon carbide cuttings.
According to industry insiders, since silicon wafers require high surface requirements, liquid cutting using silicon carbide cutting lines can protect the smoothness of the surface of the wafer being cut more than the solid cutting of the diamond cutting line. Therefore, green silicon carbide wire cutting is still used in this field, not diamond cutting lines. Unfortunately, the current domestic production capacity of silicon wafers is mainly concentrated in 4-6 inches. The 8-12 inch silicon wafer is mainly imported. Therefore, many of these types of abrasives are exported to wafer manufacturing companies such as Japan and South Korea.
Silicon carbide powder for silicon wafer cutting has special requirements. According to the processing precision requirements, it is required to meet the requirements of Japanese abrasive standards JIS2000#, JIS2500# and other standards. In addition, the surface is sharp and has self-sharpness. In addition, trace elements can not exceed the standard, otherwise the residue on the semiconductor material will bring harm.
